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Surface and Nanostructure Metrology Group
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Welcome
The Surface and Nanostructure Metrology Group (683.02) in the Semiconductor & Dimensional Metrology Division (683) of the Physical Measurement Laboratory (PML) at the National Institute of Standards and Technology (NIST), realizes and disseminates the SI unit of length and conducts research and development in length-related measurements, standards, and data-analysis practices in support of trade and U.S. manufacturing products and processes, where surface roughness and nano-structure dimensional form are critical. Feature dimensions of interest typically range from the nanometer scale to several micrometers. Measurements traceable to the definition of the meter for pitch, critical dimension and form are made, for example, by tunneling microscope, atomic force microscope, mechanical profilometry, and a variety of optical methods including phase-measuring interferometry. Special emphasis is placed on meeting the advanced needs of U.S. microelectronic manufacturing industries and the emerging nanomanufacturing and nanotechnology industries. Technical Areas
Programs/Projects
Measurement Methods and Services for Optical Reference Surfaces—Interferometry is the leading method for measuring ultra-precision surfaces and optical elements. The accuracy of the measurement results is to a large extent determined by the errors in the shape … Comparison and Uncertainty Evaluation of Methods for Asphere Metrology—The goal of this project is a rigorous uncertainty assessment of generic methods for measuring aspheres. The evaluated methods include zonal and annular stitching, local curvature measurement, and … Measuring the Height Transfer Function of Phase-Shifting Interferometers—There is an increasing need for accurate measurements of precision surfaces and optical elements over a wide range of spatial frequencies. Ripple in an optical surface, for example, can decrease … Metrology for Advanced Optics—From projecting computer chip designs onto silicon wafers to imaging remote galaxies, advanced optics are crucial to modern technology and science. As the demand for sophisticated optical … Measuring Aspheric Optics using Binary Holograms—Aspheric surfaces are indispensable in high-performance optical systems. The ability to accurately manufacture these surfaces to the required shape depends on the ability to measure them. In this … Nano-Structured Optics for Measuring Spherical Surfaces with Large Radii—The goal of this project is to solve the problem of measuring the form error and radius of spherical optical surfaces with large radius of curvature through the innovative application of … Wafer Flatness and Wafer Thickness Variation—The semiconductor industry expects continued demand for improved wafer flatness at the exposure site to avoid blurring of ever smaller circuit features due to out-of-focus exposures. This is a … Micrometer Level Surface Finish Metrology—Provide optical three-dimensional surface topography measurement at the micrometer level. Conventional surface topography involves contact stylus instruments and are considered the "gold … Atom-Based Standards and Fabrication—A primary goal of this project is to develop intrinsic calibration standards based on the crystalline lattice. The ultimate limit for nanoscale length metrology is the development of intrinsic … Overlay Instrument and Wafer Target Designs—A modern semiconductor chip has an enormous number of densely packed features that can measure smaller than 30 nanometers wide, built up in layers during as many as 27 lithographic process steps. … High-Throughput Nanometrology with Scatterfield Microscopy—Develop optical methods with extremely high throughput rates to accurately measure nanoscale features and objects. High-throughput is a requirement for effective control of manufacturing processes … Nanometer Scale Dimensional Metrology—Nanometer scale metrology for instrument calibration applications such as atomic force microscopy or scanning electron microscope calibrations will be focused on 100 μm by 100 μm … Wafer Level AFM Metrology for Critical Dimension Measurements—Significant manufacturing metrology challenges exist beyond scale calibration for the accurate determination of the size width and length of physical features. Measurement of linewidth or critical … |
Highlights
Contact
Physical Measurement Laboratory (PML) |
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