Circuit Board Assemblies

UNICOR/FPI technicians are highly skilled at fabricating and soldering printed circuit board (PCB) assemblies. This process incorporates rigid multilayers and backplanes, flexible and rigid circuits, high-performance designs, radio-frequency and microwave circuits, card cages and racks, heat sinks, buried resistors and capacitance.

While circuit board assembly is labor intensive, our facilities and technicians are noted for their capacity to meet aggressive delivery schedules while producing high-reliability products that meet exacting specifications. For example, our precision-soldered multilayered circuit card assemblies and communication equipment kits are among the many assemblies we produce to Department of Defense and military standards.

UNICOR/FPI circuit board assemblies have wide use in military and agency communications, radar systems, control panels and sensors for combat jets, helicopters and ground combat vehicles as well as missile guidance systems.

Electrical Connectors

Through our broad military and federal agency experience, UNICOR/FPI technicians have in-depth knowledge of most standard and heavy-duty electrical connectors used in military, avionics, power distribution and communications applications.

We are a qualified and approved source for QPL (Qualified Product List) manufacturing and distribution of military specification and military standard connectors. Our services also encompass molding of synthetic rubber, chemically cured compounds and thermoplastics to produce caps, covers, bushings, isolators and electrical connectors to military and commercial specifications. Our technicians are also adept at overmoldings that provide strain relief, and added safety and reliability, at key connection points.

UNICOR/FPI produces a wide range of connectors for military, agency and commercial use. These include electrical, co-axial, optical, cylindrical, bolt mounted, panel mounted and power distribution connectors, as well as array connectors, EMI adapters, power docks and high-density backplane interconnects.