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Title: Chip
Description: (2005) Chip in new type of soldered package
From the History of NIST Quantum Voltage Standards
Subjects (names):
Topics/Categories:
Type: Photo/Color
Source: National Institute of Standards and Technology
Credit Line as it should
appear in print:
Credit: Glaze/NIST
AV Number: 11PML031
Date Created: Unknown
Date Entered: 3/30/2011

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